Title:
半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法
Document Type and Number:
Japanese Patent JP4452127
Kind Code:
B2
Inventors:
Takanobu Koshimizu
Urakawa Toshiya
Yoshihisa Saimoto
Shinichi Hayakawa
Urakawa Toshiya
Yoshihisa Saimoto
Shinichi Hayakawa
Application Number:
JP2004163052A
Publication Date:
April 21, 2010
Filing Date:
June 01, 2004
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
H01L21/683; H01L21/304; H01L21/68
Domestic Patent References:
| JP8222535A | ||||
| JP2004006630A | ||||
| JP2003338535A | ||||
| JP7201787A | ||||
| JP2002069396A | ||||
| JP11238710A |
Attorney, Agent or Firm:
Koichi Washida