ADHESIVE FILM

Japanese Patent JP2010121124

A

To provide an adhesive film which is capable of suppressing the deformation of a glass substrate while maintaining good connection reliability and has good film plasticity when used for connection of a glass substrate to a semiconductor device.

The adhesive film is formed of an adhesive agent that can be obtained by mixing a curable resin composition with 2 or more types of insulation organic particles with different mean particle diameters, wherein among the 2 or more types of insulation organic particles, the highest mean particle diameter ranges from 2 to 5 m and the lowest mean particle diameter ranges from 0.05 to 0.5 m and the total content of the 2 or more types of insulation organic particles contained in the adhesive film ranges from 10 to 50 mass% based on the mass of the whole adhesive film.

WO/1998/047329	ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD
JP2004315710	ALPHACYANOACRYLATE ADHESIVE COMPOSITION
JP6068279	A temporary joining layer for semiconductor device manufacture, a layered product, and a manufacturing method of a semiconductor device

TO GYOREI
NAGAI AKIRA
KAWAKAMI SUSUMU
KATOGI SHIGEKI

JP2009243703A

June 03, 2010

October 22, 2009

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HITACHI CHEMICAL CO LTD

C09J201/00; C09J4/00; C09J7/00; C09J9/02; C09J11/04; C09J11/08; C09J163/00; C09J183/04; H01B1/22; H01B5/16

JPH0864961A	1996-03-08
JP2002327166A	2002-11-15
JP2001085083A	2001-03-30
JPH11329069A	1999-11-30

Yoshiki Hasegawa
Yoshinori Shimizu
Hideki Okita

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