Title:
無接着剤横継ぎ合わせ圧密機器及び無接着剤横継ぎ合わせ圧密方法
Document Type and Number:
Japanese Patent JP6928393
Kind Code:
B2
Abstract:
To provide a non-adhesive lateral joint consolidation apparatus and a non-adhesive lateral joint consolidation method.SOLUTION: (1) Several lateral joint plates are sequentially arranged on a plane, and a resin film is sandwiched between adjacent two lateral joint plates, and an arrangement plate is manufactured so that a contact surface of the adjacent two lateral joint plates forms an angle of 45-135° with respect to the plane. (2) A first acting force F1 of 1.5-2 MPa is applied in a horizontal direction of the arrangement plate. (3) The arrangement plate is heated up to 60-150°C, and a second acting force F2 of 0.7 MPa or above is applied in a vertical direction of the arrangement plate, to keep a pressure for 8-10 min. (4) Under a state of keeping F2, F1 is increased to F3 of 2.5-4 MPa, and the pressure is kept while the temperature of the arrangement plate is 40°C or above. A manufacturing method provided by the present invention is simple and practical, and impregnation separability and surface adhesive strength of a manufactured plate material can be more improved, and in the plate material manufactured in this method, the adjacent two wood boards are hard to separate from each other and hard to tear, and firmly bonded.SELECTED DRAWING: Figure 1
Inventors:
King Kai
Application Number:
JP2020002157A
Publication Date:
September 01, 2021
Filing Date:
January 09, 2020
Export Citation:
Assignee:
King Kai
International Classes:
B29C65/50; B27D1/04
Domestic Patent References:
| JP62267101A | ||||
| JP49041510A |
Foreign References:
| CN203331154U |
Attorney, Agent or Firm:
Hitoshi Shinbo