PURPOSE: To obtain the subject adhesive enabling the connection of fine circuit, having excellent long-term connection reliability and capable of quickly and stably forming a connection at a low temperature by compounding a reactive adhesive with a specific 4-(dialkylamino)pyridine derivative and electrically conductive particles.
CONSTITUTION: The objective adhesive can be produced by compounding (A) 100 pts.wt. of a reactive adhesive composed of epoxy resin, etc., with (B) 0.1-30 pts.wt. (preferably 5-20 pts.wt.) of a curing catalyst consisting of a 4- dialkylamino pyridine derivative having the organic group of formula and (C) 0.1-20vol.% (preferably 0.5-15vol.%) of electrically conductive particles made of Ni, Co, Sb, Pb, Ag, Pt, Sn, etc. The component B is e.g. 4- dimethylaminopyridine, 4-benzylmethylaminopyridine, 4-pyrrolidinopyridine, 4-diallylamino-pyridine polymer or a copolymer of the pyridine derivative and a monomer containing vinyl group.
YAMAGUCHI YUTAKA
OTA TOMOHISA
TSUKAGOSHI ISAO
