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Title:
ADHESIVE LAMINATE AND LAMINATE
Document Type and Number:
Japanese Patent JP2018030294
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive laminate that makes it possible to bond a polyimide film to an adherend, and inhibit a decrease in the bonding strength even when the laminate after the bonding is exposed to a high temperature of more than 300°C.SOLUTION: An adhesive laminate has a polyimide layer, and an adhesion layer on at least one side of the polyimide layer. The adhesion layer has at least one aromatic polyamic acid having an aromatic tetracarboxylic acid dianhydride-derived constitutional unit and an aromatic diamine-derived constitutional unit, and at least one aromatic polyimide, at a mass ratio of 8:2-2:8.SELECTED DRAWING: None

Inventors:
IMANISHI KATSUYA
OGASAWARA TAKESHI
MINEO YUTAKA
WATANUKI HIROKO
TOMINAGA SHIGETAKE
KOBAYASHI KAZUNORI
Application Number:
JP2016163914A
Publication Date:
March 01, 2018
Filing Date:
August 24, 2016
Export Citation:
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Assignee:
TOHO KASEI KK
International Classes:
B32B27/34; B32B7/12; C08G73/10; C09J7/20; C09J11/06; C09J179/08
Domestic Patent References:
JP2016020488A2016-02-04
Attorney, Agent or Firm:
Mitsuo Tanaka
Takuji Yamada
Kenichi Morizumi
Iwako Iwaki