Title:
ADHESIVE LAYER AND/OR BONDING AGENT LAYER
Document Type and Number:
Japanese Patent JP2023081331
Kind Code:
A
Abstract:
To provide an adhesive layer and/or a bonding agent layer which exhibits excellent handling properties before adhesion or bonding to a member, while exhibiting excellent flexibility after adhesion or bonding to the member.SOLUTION: Provided are an adhesive layer and/or a bonding agent layer which shows a reduction of stress upon external stimuli. It is preferable that the stress does not increase once reduced. It is preferable that the ratio (S1(100)/S2(100)) of the stress (S1(100)) at 100% strain before application of external stimuli to the stress (S2(100)) at 100% strain after application of external stimuli is less than 0.95.SELECTED DRAWING: Figure 1
Inventors:
TOBINAGA SHUN
AMAMIYA KOTARO
MIZUNO DAISUKE
NAKANO TAKESHI
IWATA SATOSHI
AMAMIYA KOTARO
MIZUNO DAISUKE
NAKANO TAKESHI
IWATA SATOSHI
Application Number:
JP2022188636A
Publication Date:
June 09, 2023
Filing Date:
November 25, 2022
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/38; C09J5/00; C09J201/00
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical