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Title:
ADHESIVE FOR LIGNOCELLULOSE
Document Type and Number:
Japanese Patent JP2003055637
Kind Code:
A
Abstract:

To provide an adhesive which is used for a lignocellulose, does not contain formaldehyde, does not generate formaldehyde in reaction, and can reveal excellent flexibility and water resistance by e.g. hot press molding, and a molded article obtained by molding a lignocellulose with the adhesive.

The adhesive for a lignocellulose contains a thermoplastic resin (A) having a glass transition temperature of 0°C or lower, a water-soluble and/or water-dispersible polycarboxylic acid (B), a water-soluble and/or water- dispersible poly-2-oxazoline compound (C), and water. The molded article is obtained by molding a lignocellulose with the adhesive.


Inventors:
YAMAGUCHI TAKASHI
SATO HARUYUKI
KAWABE KUNIYASU
TAMURA YASUO
YAMAUCHI HIDEFUMI
Application Number:
JP2001000244024
Publication Date:
February 26, 2003
Filing Date:
August 10, 2001
Export Citation:
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Assignee:
KAO CORP
KOYO SANGYO CO
International Classes:
B27D1/04; B27N3/00; C09J109/06; C09J125/10; C09J133/02; C09J135/00; C09J139/04; C09J201/00; (IPC1-7): C09J201/00; B27D1/04; B27N3/00; C09J109/06; C09J125/10; C09J133/02; C09J135/00; C09J139/04
Domestic Patent References:
JPH11216704A1999-08-10
JPH09248807A1997-09-22
JP2000001594A2000-01-07
JP2003055628A2003-02-26
JP2003055629A2003-02-26
Attorney, Agent or Firm:
細田 芳徳