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Title:
ADHESIVE MELTER HAVING QUICK CHANGE PUMP PACK ASSEMBLY AND ASSOCIATED METHODS
Document Type and Number:
Japanese Patent JP2014138926
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an improved assembly and process for mounting a pump, a motor, and a drive coupling on an adhesive melter of a dispensing system.SOLUTION: The adhesive melter includes a melter support frame with a spring-loaded support, and a manifold for receiving molten adhesive. The melter also includes a pump pack assembly having: a rigid frame carrying a pump for directing a flow of molten adhesive through the manifold; a motor; and a drive coupling operatively connecting the pump and motor. The pump pack assembly is collectively mounted as a unit on the melter support frame by positioning the rigid frame on the spring-loaded support, moving the pump into abutment with the manifold, and fastening the pump into fluid-tight engagement with the manifold, the spring-loaded support adjusting in position during fastening to assist with carrying the pump pack assembly as a cantilever load.

Inventors:
CHARLES P GANZER
Application Number:
JP2013244660A
Publication Date:
July 31, 2014
Filing Date:
November 27, 2013
Export Citation:
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Assignee:
NORDSON CORP
International Classes:
C09J5/06; B05C5/04; F04B15/04; F04B53/00
Domestic Patent References:
JP2004116782A2004-04-15
JP2004268017A2004-09-30
JPS5833826Y21983-07-28
JP2002282761A2002-10-02
JPS5357241A1978-05-24
JP2004077133A2004-03-11
JP2010518233A2010-05-27
JP2005238233A2005-09-08
JP2015510566A2015-04-09
JPH09192577A1997-07-29
Attorney, Agent or Firm:
Okabe
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kosuke Uchida