Title:
ADHESIVE MEMBER, METHOD FOR PRODUCING THE SAME AND ADHESION STRUCTURE
Document Type and Number:
Japanese Patent JP2010070725
Kind Code:
A
Abstract:
To provide an adhesive technique by which high adhesive strength against hot water and steam can be obtained, excellent in durability against strong alkalis and strong acids, and which uses a plastic substrate firmly adhered to an adherend in advance, in bonding the plastic substrate to which good adhesiveness can not be obtained even with an epoxy-based adhesive to the adherend.
An adhesive member 1 includes a plastic substrate 2 and an uncured epoxy-based adhesive layer 3. The plastic substrate 2 has chemical bonds between nitrogen functional groups introduced by surface treatment on the interface contacting the epoxy-based adhesive layer 3 and epoxy groups of the epoxy-based adhesive.
Inventors:
IIZUKA HIROKAZU
OKAMOTO MASARU
TAKEI KUNIHIRO
ISOBE BUYO
NANAUMI MASAAKI
ISHIDA KENTARO
KANEOKA NOBUYUKI
MATSUBARA TAKESHI
OKAMOTO MASARU
TAKEI KUNIHIRO
ISOBE BUYO
NANAUMI MASAAKI
ISHIDA KENTARO
KANEOKA NOBUYUKI
MATSUBARA TAKESHI
Application Number:
JP2008242873A
Publication Date:
April 02, 2010
Filing Date:
September 22, 2008
Export Citation:
Assignee:
FUJIMORI KOGYO CO
HONDA MOTOR CO LTD
HONDA MOTOR CO LTD
International Classes:
C09J7/02; B32B27/38; C09J163/00
Domestic Patent References:
JP2004528425A | 2004-09-16 | |||
JPS5366973A | 1978-06-14 | |||
JPH11209487A | 1999-08-03 | |||
JPS5418872A | 1979-02-13 | |||
JP2004528425A | 2004-09-16 | |||
JPH11209487A | 1999-08-03 | |||
JPS5418872A | 1979-02-13 | |||
JPS63297434A | 1988-12-05 | |||
JPH07149929A | 1995-06-13 | |||
JPS5366973A | 1978-06-14 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe
Previous Patent: REMOVING LIQUID FOR CURABLE COMPOSITION
Next Patent: INSULATING FILM-FORMING COMPOSITION, INSULATING FILM, AND ELECTRON DEVICE
Next Patent: INSULATING FILM-FORMING COMPOSITION, INSULATING FILM, AND ELECTRON DEVICE