Title:
ADHESIVE MEMBER FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008277806
Kind Code:
A
Abstract:
To provide an adhesive member for semiconductor, a semiconductor device and a method for manufacturing the semiconductor device, whose reaction speed can be adjusted by irradiating radiant rays, and crosslink density also can be easily adjusted and then the design margin of its film is improved.
The adhesive member comprises an adhesive agent layer and a base material layer. The adhesive agent layer contains: (A) an epoxy resin and an epoxy resin curing agent, (B) a polymer containing a functional group and having 100,000 weight average molecular weight or higher, (C) a proton-donating compound, (D) photoacid producing agent, and (E) a radioactive ray polymerizing compound.
Inventors:
YUASA TOMOHITO
KATO SHINYA
KATO SHINYA
Application Number:
JP2008099519A
Publication Date:
November 13, 2008
Filing Date:
April 07, 2008
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L21/52; C08F8/30; C08F220/32; C08G18/77; C09J4/02; C09J7/02; C09J11/06; C09J133/14; C09J163/00; H01L21/301
Domestic Patent References:
| JP2007308694A | 2007-11-29 | |||
| JP2003327925A | 2003-11-19 | |||
| JP2005276971A | 2005-10-06 | |||
| JP2002256227A | 2002-09-11 | |||
| JP2004165687A | 2004-06-10 | |||
| JP2004295116A | 2004-10-21 | |||
| JPH11212263A | 1999-08-06 | |||
| JP2007016074A | 2007-01-25 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu