Title:
ADHESIVE RESIN COMPOSITION AND BINDING MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2009114352
Kind Code:
A
Abstract:
To provide a photocurable adhesive resin composition excellent in adhesion to various adherends such as metal oxides, metals and resins.
The adhesive resin composition comprises a urethane (meth)acrylate oligomer (A), a cyclic monomer having a (meth)acryloyl group (B), and a (meth)acrylate phosphate (C). It is preferable that the adhesive resin composition further comprises a resin having a melamine skeleton (D). A preferred additive amount of the (meth)acrylate phosphate (C) is in a range of 0.01-3 parts by mass based on 100 parts by mass, in total, of the urethane (meth)acrylate oligomer (A) and the cyclic monomer having a (meth)acryloyl group (B).
Inventors:
KITANO SO
AKAMA HIDEHIRO
SAKATA JUNJI
AKAMA HIDEHIRO
SAKATA JUNJI
Application Number:
JP2007289601A
Publication Date:
May 28, 2009
Filing Date:
November 07, 2007
Export Citation:
Assignee:
BRIDGESTONE CORP
International Classes:
C09J4/02; C08F290/06; C09J161/28; C09J175/16
Attorney, Agent or Firm:
Kenji Sugimura
Kosaku Sugimura
Kiyoshi Kuruma
Shiro Fujitani
Tatsuya Sawada
Kazuyuki Tomita
Kosaku Sugimura
Kiyoshi Kuruma
Shiro Fujitani
Tatsuya Sawada
Kazuyuki Tomita