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Title:
接着剤樹脂組成物、カバーレイフィルム及び回路基板
Document Type and Number:
Japanese Patent JP5148758
Kind Code:
B2
Inventors:
Ryo Mori
Yoshiki Sudo
Koji Nakamura
Application Number:
JP2011534167A
Publication Date:
February 20, 2013
Filing Date:
September 08, 2010
Export Citation:
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Assignee:
Nippon Steel & Sumikin Chemical Co., Ltd.
International Classes:
H05K3/28; C09J7/02; C09J179/08; C09J183/04
Domestic Patent References:
JPH07258410A1995-10-09
JP2004211064A2004-07-29
JP2005113014A2005-04-28
JPH07258410A1995-10-09
JP2004211064A2004-07-29
JP2005113014A2005-04-28
JP2002121530A2002-04-26
Attorney, Agent or Firm:
Kazuhiro Watanabe
Katsumi Hoshimiya
Tatsuya Josawa



 
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