Title:
接着剤樹脂組成物、カバーレイフィルム及び回路基板
Document Type and Number:
Japanese Patent JP5148760
Kind Code:
B2
Abstract:
Disclosed is an adhesive resin composition containing 100 parts by weight of component (a) which is a polyimide siloxane containing the structural units represented by general formula (1) and (2) (in the formula, Ar represents a tetravalent aromatic group derived from an aromatic tetracarboxylic anhydride, R1 represents a divalent diaminosiloxane residue derived from a diaminosiloxane, R2 represents a divalent aromatic diamine residue derived from an aromatic diamine, and m and n represent the molar ratio of each of the structural units, wherein m is between 0.75 and 1.0, and n is between 0 and 0.25), and 5 to 200 parts by weight of component (b) which is a plate-like inorganic filler, the average particle diameter of which is between 2 and 25µm.
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Inventors:
Ryo Mori
Yoshiki Sudo
Koji Nakamura
Yoshiki Sudo
Koji Nakamura
Application Number:
JP2011538336A
Publication Date:
February 20, 2013
Filing Date:
October 13, 2010
Export Citation:
Assignee:
Nippon Steel & Sumikin Chemical Co., Ltd.
International Classes:
H05K3/28; C09J7/22; C09J7/35; C09J11/04; C09J179/08; C09J183/04
Domestic Patent References:
| JP2004121530A | 2004-04-22 | |||
| JP2004211064A | 2004-07-29 | |||
| JP2005113014A | 2005-04-28 | |||
| JPH07258410A | 1995-10-09 | |||
| JP2002121530A | 2002-04-26 | |||
| JP2004211064A | 2004-07-29 | |||
| JP2005113014A | 2005-04-28 |
Attorney, Agent or Firm:
Kazuhiro Watanabe
Katsumi Hoshimiya
Tatsuya Josawa
Katsumi Hoshimiya
Tatsuya Josawa