接着剤樹脂組成物、その硬化物、及び接着剤フィルム

Japanese Patent JP5761639

B2

PROBLEM TO BE SOLVED: To provide an adhesive resin composition in which its cured product has excellent thermal conductivity, and deterioration of adhesiveness and insulation is hardly occurred.SOLUTION: The adhesive resin composition contains: an epoxy resin in which epoxy resin of 150 to 220 epoxy equivalent is contained by 50 wt.% or more in the epoxy resin total amount; a curing agent consisting of an imidazole compound; phenoxy resin; and alumina powder. Ammonium ion in the cured product is 50 wt.ppm or less. A maximum particle diameter of the alumina powder is 120 μm or less, and a rate of crystalline spherical alumina in all alumina powder is 90 wt.% or more. In the crystalline spherical alumina, (i) the alumina in which an average particle diameter Dis 35 to 50 μm and [volume-average particle diameter]/[number-average particle diameter] is 1.2 to 2.0, is 30 to 50 wt.%; (ii) the alumina in which the average particle diameter Dis 5 to 15 μm, and [Volume average particle diameter]/[number average particle diameter] is 2.0 to 3.5 is 30 to 50 wt.%; (iii) the alumina in which the average particle diameter Dis 0.1 to 2 μm is 10 to 30 wt.%.

WO/2015/198921	PHOTOCURABLE COMPOSITION AND OPTICAL ELEMENT ADHESIVE INCLUDING SAME
JP5811688	Thermal cationic polymerizable composition, anisotropic conductive adhesive film, connection structure and method for producing the same.
JPH0782544	VISIBLE-LIGHT-CURING ADHESIVE

Shigeaki Tauchi
Finance Department Satoshi
Noriyuki Anai

JP2011172459A

August 12, 2015

August 06, 2011

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Nippon Jojo Co., Ltd.

C09J163/00; C09J7/00; C09J11/04; C09J11/06; C09J171/12

JP2007246861A
JP9135081A
JP9012994A
JP2006022179A
JP2001348488A
JP5070756A
JP2003073649A
JP2012077123A
JP4266922A

Yuichi Sudo

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