To improve heat conductivity as well as both adhesivity and flexibility in a resin composition containing a polyimide resin and an inorganic filler.

There is provided an adhesive resin composition containing an inorganic filler and a polyimide resin. The inorganic filler content in the resin composition is not greater than 58% by a volume ratio; the resin composition contains secondary particles produced by agglomerating 15-1,000 of primary particles each other of the inorganic filler; and the volume ratio of a tertiary aggregation of a region of the secondary particles disposed with an each distance of not greater than 0.05 m to the entire resin composition is not less than 20 vol.%. Further, the polyimide resin is a polyimide obtained by reacting (a) moles of a tetracarboxylic acid dianhydride constituent and (b) moles of a diamine constituent within the range of a/b=0.8-1.2; and the diamine constituent contains (c) moles of an amine constituent of the chemical formula (1) within the range of c/b=0.01-1.0 (wherein n is an integer of 1-50; and Xs are each independently a 1-10C alkylene group).