Title:
ADHESIVE RESIN COMPOSITION, ADHESIVE TAPE, ADHESIVE TAPE WITH SUBSTRATE AND COMPOSITE ARTICLE
Document Type and Number:
Japanese Patent JP2015232108
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive resin composition capable of being used as an adhesive good in adaptability to a fiber reinforced thermoplastic (FRTP) and capable of exhibiting sufficient adhesive strength to other adherend, an adhesive tape formed by curing the adhesive resin composition, further an adhesive tape with a substrate having a substrate layer and a layer formed by curing the adhesive resin composition, further a composite article containing one of the adhesive resin composition, the adhesive tape and the adhesive tape with the substrate as well as the fiber reinforced thermoplastic (FRTP).SOLUTION: The adhesive resin composition is an adhesive resin composition containing a polyamide resin and an epoxy resin and a shear adhesive power of an adhesive tape formed by curing the adhesive resin composition to a fiber reinforced thermoplastic is 2.5 MPa to 70.0 MPa at 25°C and 2.2 MPa to 70.0 MPa at 80°C.
Inventors:
FUJII TAKAHIRO
FURUSO MASASHI
FURUSO MASASHI
Application Number:
JP2014259720A
Publication Date:
December 24, 2015
Filing Date:
December 24, 2014
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J163/00; C08G59/46; C09J7/00; C09J7/02; C09J177/00
Domestic Patent References:
| JP2013014638A | 2013-01-24 | |||
| JP2013006974A | 2013-01-10 |
Foreign References:
| WO2005031037A1 | 2005-04-07 |
Other References:
表面処理技術ハンドブック−接着・塗装から電子材料まで−, vol. 初版, JPN6018048786, 7 January 2001 (2001-01-07), pages 158 - 161, ISSN: 0004051197
Attorney, Agent or Firm:
Katsuto Momii
Yoshida Masayasu
Yoshida Masayasu