ADHESIVE FOR SEALING SEMICONDUCTOR AND PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE

Title:

ADHESIVE FOR SEALING SEMICONDUCTOR AND PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2012236883

Kind Code:

A

Abstract:

To provide: an adhesive for sealing a semiconductor with which generation of voids is sufficiently controlled even in high temperature connection, and flux activity of a flux agent is obtained effectively; a production method therefor; and a semiconductor device produced by using the adhesive for sealing the semiconductor.

This adhesive for sealing the semiconductor is obtained by removing at least a part of organic solvent from an adhesive varnish containing (a) an epoxy resin, (b) an epoxy resin-curing agent, (c) a flux agent and (d) an organic solvent, so as to satisfy the following formulae (I) and (II). The formula (I) is [(reaction initiation temperature of adhesive for sealing semiconductor)≥(boiling point of (d) organic solvent)]. The formula (II) is [0.5≤(content (mass%) of (d) organic solvent in adhesive for sealing semiconductor)≤1.5].

Inventors:

HONDA KAZUTAKA
NAGAI AKIRA
ENOMOTO TETSUYA

Application Number:

JP2011105537A

Publication Date:

December 06, 2012

Filing Date:

May 10, 2011

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C09J163/00; C08G59/18; C09J7/00; C09J11/06; C09J179/08; H01L21/60; H01L23/29; H01L23/31

Domestic Patent References:

JP2009256587A	2009-11-05
JP2006245242A	2006-09-14
JP2011026374A	2011-02-10
JP2001223227A	2001-08-17
JP2008172275A	2008-07-24

Foreign References:

WO2008054011A1

2008-05-08

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano

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