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Patent Searching and Data


Title:
ADHESIVE SHEET FOR BONDING WAFER
Document Type and Number:
Japanese Patent JPH04192542
Kind Code:
A
Abstract:

PURPOSE: To make it possible to inhibit the deterioration in adhesion properties and restore said properties by proper heating by comprising a soft vinyl chloride layer as one layer which constitutes a base material and demodified nylon, urethane photosensitive rubber or resin, ethylene vinyl alcohol copolymer or polyvinylidene chloride as other layers which constitute said base material.

CONSTITUTION: A base material 2 comprises at least two component layers. One layer which constitutes the base material is soft vinyl chloride while the other layer which constitutes the base material is faced with an adhesive layer. Moreover, the other layer which constitutes the base material comprises demodified nylon, photosensitive rubber or resin, ethylene vinyl alcohol copolymer or polyvinylidene chloride. Provision of such a specific middle layer makes it possible to inhibit effectively a soft vinyl chloride layer from transferring to an adhesive layer or plasticizer or a stabilizer and restore by proper heating and prevent the generation of elongation of deflection.


Inventors:
SENOO HIDEO
MINEURA YOSHIHISA
EBE KAZUYOSHI
KOGURE MASAO
Application Number:
JP32402290A
Publication Date:
July 10, 1992
Filing Date:
November 27, 1990
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
C09J7/02; C09J133/00; H01L21/301; H01L21/78; (IPC1-7): C09J7/02; H01L21/78
Attorney, Agent or Firm:
Shunichiro Suzuki