To provide a pressure-sensitive adhesive sheet, and to provide a method for producing an electronic component using the same.

This pressure-sensitive adhesive sheet comprises an antistatic layer containing an organic binder, an antistatic agent, and a friction reducing agent on one of surfaces of a base layer and a pressure-sensitive adhesive layer on the other surface, and the method for producing the electronic component is provided. The pressure-sensitive adhesive sheet has such characteristics as to control frictional electrification, to be excellent in slipperiness, and to enough and uniformly expand a pressure-sensitive adhesive tape, and therefore the pressure-sensitive adhesive sheet is suitable for the method for producing the electronic component in which an electronic component aggregate given by forming a circuit pattern on a semiconductor wafer or a circuit board material is diced and formed into the electronic component.

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