Title:
ADHESIVE, ADHESIVE SHEET AND FLEXIBLE COPPER CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2021141108
Kind Code:
A
Abstract:
To develop an adhesive for a flexible copper clad laminate that achieves both characteristics comparable to a 2-layer FCCL manufactured by a casting method and productivity equal to or higher than the productivity of a 2-layer FCCL manufactured by a laminating method, and to provide an adhesive sheet and a flexible copper clad laminate (2.2-layer FCCL) which are manufactured using the adhesive for a flexible copper clad laminate.SOLUTION: The present invention provides an adhesive for a flexible copper clad laminate to bond a polyimide film substrate and a copper foil constituting a flexible copper clad laminate. The adhesive for a flexible copper clad laminate contains solvent-soluble polyimide having a repeating unit with a phenylindane structure, an epoxy resin, and a hardener. A film obtained by heating for 90 minutes at 180°C and hardening a semi-cured film made from the adhesive has a tensile modulus of 1-10.0 GPa or less and a Tg of 120-190°C. The present invention also provides an adhesive sheet and a flexible copper clad laminate which include an adhesive sheet layer containing the adhesive of the present invention.SELECTED DRAWING: None
Inventors:
SUZUKI TETSUAKI
KUROSAWA INETARO
KUROSAWA INETARO
Application Number:
JP2020035017A
Publication Date:
September 16, 2021
Filing Date:
March 02, 2020
Export Citation:
Assignee:
HEFEI HANNOWA NEW MATERIALS TECH CO LTD
International Classes:
H05K1/03; B32B7/022; B32B7/027; B32B15/088; B32B15/092; B32B15/20; B32B27/34; B32B27/38; C09J7/35; C09J11/06; C09J163/00; C09J179/08
Attorney, Agent or Firm:
Patent Service Corporation Tanigawa International Patent Office