Title:
ADHESIVE, ADHESIVE SHEET AND FLEXIBLE COPPER-CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2022046213
Kind Code:
A
Abstract:
To provide an adhesive for a flexible copper-clad laminate, capable of achieving dielectric characteristics, thermal characteristics, working characteristics, adhesion characteristics, and moisture absorption characteristics, and costs in good balance without using a cross-linking agent, and to provide an adhesive sheet and a flexible copper-clad laminate manufactured by using the same.SOLUTION: An adhesive for a flexible copper-clad laminate, to be used for adhering a polyimide film base material to a copper foil contains: a solvent-soluble polyimide having a repeating unit represented by the following general formula [I] and subjected to dehydrating and ring-closing imidization; and a silane coupling agent represented by the following general formula [II]. (In formula [I], Z is a bisphenol type acid dianhydride residue, and Ar is a dimer diamine residue and/or a fluorine-containing diamine residue.) (RO)3Si-X [II] (in formula [II], X is a group having a ketimine structure or an aldimine structure, and R is an alkyl group.)SELECTED DRAWING: None
Inventors:
SUZUKI TETSUAKI
YAMADA KAZUMI
YAMADA KAZUMI
Application Number:
JP2020152144A
Publication Date:
March 23, 2022
Filing Date:
September 10, 2020
Export Citation:
Assignee:
HEFEI HANNOWA NEW MATERIALS TECH CO LTD
International Classes:
B32B15/088; C09J179/08; B32B27/00; B32B27/34; C08G73/10; C09J7/35; C09J11/06; H05K1/03
Attorney, Agent or Firm:
Patent Service Corporation Tanigawa International Patent Office