Title:
半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6909171
Kind Code:
B2
Abstract:
The present invention provides: an adhesive sheet that, before a peeling step, stays fully and stably stuck to a back surface of a lead frame and a back surface of a sealing resin and does not leak sealing resin, even after being subjected to a QFN assembly thermal history, and that, during the peeling step, can be easily peeled away and does not leave an adhesive residue or break; and a semiconductor device production method that uses the adhesive sheet. An adhesive sheet for semiconductor device production. The adhesive sheet: comprises a base material and a thermosetting adhesive layer that is provided on one surface of the base material; and is to be peelably adhered to a lead frame or a wiring board of a semiconductor device. The adhesive layer contains a carboxyl-group-containing acrylonitrile/butadiene copolymer (a), an epoxy resin (b) that has structural formula (1), and a compound (c) that contains at least two maleimide groups, the remaining amount of unreacted maleimide being 0.02–0.13.
Inventors:
Kondo Kyoji
Fungbong Peak
Yuki Matsunaga
Fungbong Peak
Yuki Matsunaga
Application Number:
JP2018022641A
Publication Date:
July 28, 2021
Filing Date:
February 12, 2018
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
H01L21/56; C09J7/35; C09J109/02; C09J163/00; C09J179/04
Domestic Patent References:
| JP200895014A | ||||
| JP2016183237A |
Foreign References:
| WO2018143343A1 |