Title:
接着シート、及び当該接着シートを使用して得られる多層プリント基板
Document Type and Number:
Japanese Patent JP5494914
Kind Code:
B2
Abstract:
To provide an adhesive sheet having adhesion, heat resistance, and low thermal expansion properties; and to provide a high-density multilayer printed circuit board obtained by using the adhesive sheet.
In the adhesive sheet having a thermal expansion coefficient of 10 ppm or less, an epoxy resin adhesive-cured film layer (2) having a storage modulus of 2.0 MPa to 0.2 GPa at 150°C is disposed on a polyimide film (1) having a storage modulus of 2-10 GPa at 150°C and a thermal expansion coefficient of 0-6 ppm. The multilayer printed circuit board obtained by conducting electroless plating processing on the adhesive sheet is used.
COPYRIGHT: (C)2011,JPO&INPIT
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Inventors:
Takashi Tasaki
Hideki Goda
Akihisa Hamazawa
Hideki Goda
Akihisa Hamazawa
Application Number:
JP2009084685A
Publication Date:
May 21, 2014
Filing Date:
March 31, 2009
Export Citation:
Assignee:
Arakawa Chemical Industry Co., Ltd.
International Classes:
C09J7/02; B32B27/34; C09J11/00; C09J163/00; H05K3/46
Domestic Patent References:
| JP2003092378A | ||||
| JP2005314630A | ||||
| JP2005068408A |