Title:
半導体基板加工用粘着シート
Document Type and Number:
Japanese Patent JP4310932
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prepare a pressure-sensitive adhesive sheet for processing semiconductors which prevents the generation of charge in a semiconductor- manufacturing process so that it can prevent the destruction of a semiconductor device and the deterioration thereof caused by the charge. SOLUTION: There is prepared a pressure-sensitive adhesive sheet for processing semiconductor substrates, which is formed by applying a pressure- sensitive adhesive comprising a base polymer, a radiation-polymerizable compound and a radiation-polymerizable polymerization initiator onto the surface of a film substrate of an ionomer resin, in which molecules of an ethylene- methacrylate copolymer are crosslinked by way of potassium ions, to form a pressure-sensitive adhesive layer.
Inventors:
Naoya Oda
Application Number:
JP2001143556A
Publication Date:
August 12, 2009
Filing Date:
May 14, 2001
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J7/02; H01L21/301; C09J4/00; C09J201/00
Domestic Patent References:
| JP6134941A | ||||
| JP8245932A | ||||
| JP2000124169A | ||||
| JP9190990A | ||||
| JP1067971A | ||||
| JP60240704A |