Title:
ADHESIVE SHEET, PRODUCTION OF PRINTED CIRCUIT BOARD USING THE SAME AND PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3298957
Kind Code:
B2
Abstract:
PURPOSE: To improve the resistance to chemicals and adhesion between a substrate and a plated film by forming an adhesive layer, in which the fine powders of an amino resin soluble in acid, etc., and previously cured are dispersed in a specified heat-resistant resin matrix, on a base film.
CONSTITUTION: An adhesive layer, in which amino resin fine powders are dispersed in an uncured resin matric, is applied on the base film to form the adhesive layer. The amino resin is previously cured and is soluble in acid or an oxidizing agent, and the resin is selected from among melamine resin, urea resin and guanamine resin. The matrix consists of a thermosetting heat-resistant resin or a photosensitive heat-resistant resin, and the resin is made to be insoluble in acid or an oxidizing agent when cured. The sheet is superposed on a substrate, pressed and heated, then the base film is released to form an adhesive layer, the layer is coarsened and then electroless-plated to form a conductor circuit, and a printed circuit board is obtained.
Inventors:
Motoo Asai
Application Number:
JP34767892A
Publication Date:
July 08, 2002
Filing Date:
December 28, 1992
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
C09J7/02; C09J161/20; C09J201/00; C23C18/18; C23C18/20; H05K3/18; H05K3/38; (IPC1-7): C23C18/18; C09J7/02; C23C18/20; H05K3/18; H05K3/38
Domestic Patent References:
| JP2143492A | ||||
| JP6459987A | ||||
| JP1194383A | ||||
| JP1103680A |
Attorney, Agent or Firm:
Junzo Ogawa (1 person outside)