Title:
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PROTECTION
Document Type and Number:
Japanese Patent JP2022109631
Kind Code:
A
Abstract:
To provide an adhesive sheet for semiconductor device protection, by which a semiconductor wafer can be protected adequately without causing the decrease in production yield.SOLUTION: An adhesive sheet for semiconductor device protection according to the present invention comprises an adhesive layer and a base material. The adhesive layer has a surface resistivity of 1.0×1011 Ω/sq. or less. When peeling the adhesive sheet for semiconductor device protection after a silicon wafer bonded to the adhesive layer of the adhesive sheet for semiconductor device protection has been left at rest at 50°C for 24 hours, the rate of a content of halogen elements to a content of all elements in a face where the silicon wafer is bonded to the adhesive layer is 0.3 atomic% or less.SELECTED DRAWING: Figure 1
Inventors:
UENO TAIKI
MIZUNO KOJI
TANAKA SHUNPEI
HAYASHI MIKI
MIZUNO KOJI
TANAKA SHUNPEI
HAYASHI MIKI
Application Number:
JP2021005037A
Publication Date:
July 28, 2022
Filing Date:
January 15, 2021
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L21/301; C09J7/38; C09J11/04; C09J11/06; C09J11/08; C09J201/00
Attorney, Agent or Firm:
Takafumi Masui
Tomoko Uekawa
Tomoko Uekawa