Title:
基板への接着シート貼り付け装置及び貼り付け方法
Document Type and Number:
Japanese Patent JP6944625
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To adhere an adhesion tape such as a protective tape without being contacted to an inner peripheral surface of a wafer.SOLUTION: An adhesion tape attachment device comprises an adhesion tape conveying body g that holds an adhesion tape T cut in a form of a substrate W to a suction table 59 in an upper chamber 50, transmits the v onto a lower chamber 9, and adheres the adhesion tape onto the substrate W held by an adhesion table 8 of the lower chamber 9. The adhesion table 8 comprises: a table concave part 8b in which a gas introduction hole 24 is provided; and an external peripheral holding part 15 that holds an external peripheral edge part of the substrate W. A vacuum chamber is formed by the upper chamber 50 and the lower chamber 9. After a pressure of the vacuum chamber is reduced and the adhesion tape T is adhered onto the substrate W, a gas is introduced from the gas introduction hole 24 when opening the pressure. Thus, the pressure of the substrate W is applied to the suction table 59 from a back surface side.SELECTED DRAWING: Figure 2
Inventors:
Takaki Tanikawa
Koichi Kitamura
Koichi Kitamura
Application Number:
JP2016175971A
Publication Date:
October 06, 2021
Filing Date:
September 08, 2016
Export Citation:
Assignee:
Takatori Co., Ltd.
International Classes:
H01L21/683; H01L21/304
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