Title:
ウエハ加工用粘着シート、該シートを用いたマーキング方法およびマーキングチップの製造方法
Document Type and Number:
Japanese Patent JP5751615
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive sheet for wafer processing capable of preventing degradation of marking aptitude or contamination of a semiconductor device by removing gaseous contaminants generated by thermal decomposition of a wafer or a protective film efficiently, when marking the rear surface or the protective film by pasting the rear surface of a semiconductor wafer or the protective film side of a wafer with a protective film to the adhesive sheet and then radiating laser light from the adhesive sheet side.SOLUTION: The adhesive sheet for wafer processing has a through hole, and the light transmittance thereof for the wavelength of 532-1064 nm is 70% or higher.
Inventors:
Tomonori Shinoda
Yosuke Sato
Yosuke Sato
Application Number:
JP2011028838A
Publication Date:
July 22, 2015
Filing Date:
February 14, 2011
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
H01L21/301; B23K26/00; C09J7/00; H01L21/683
Domestic Patent References:
| JP2010238948A | ||||
| JP2001001642A | ||||
| JP2009154184A | ||||
| JP2005231144A |
Foreign References:
| KR1020100035451A |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation
Hitoshi Maeda
Toru Suzuki
Hitoshi Maeda
Toru Suzuki