To provide an adhesive sheet for working a wafer, which can be stuck on the silicon wafer at a low temperature less than 100°C and can be peeled excellently on an interface between a radiation cured type pressure-sensitive adhesive layer and an adhesive layer for bonding a die after the irradiation of ultraviolet rays and in which the pressure-sensitive adhesive layer and the adhesive layer are unified.

In the adhesive sheet for working the wafer in which the adhesive layer for bonding the die and the radiation cured type pressure-sensitive adhesive layer are laminated, the adhesive sheet for working the wafer containing a polyamide resin or a polyamide-imide resin having an amine value less than 40 mg KOH/g is used as the adhesive layer. In the adhesive sheet, it is preferable that the softening point of the polyamide resin is 40° to 200°C, and it is preferable that the glass transition temperature of the polyamide-imide resin is less than 150°C.