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Title:
ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2021161150
Kind Code:
A
Abstract:
To provide an adhesive sheet that can be easily removed from an adherend by application of high-frequency waves.SOLUTION: An adhesive sheet contains thermally-expandable particles and a dielectric heating filler and has a thermally-expandable layer (A) containing at least the thermally-expandable particles. The dielectric heating filler is at least one selected from the group consisting of metal oxide and metalloid carbide.SELECTED DRAWING: None

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Inventors:
KAWARADA YUKI
KAKIUCHI YASUHIKO
Application Number:
JP2020061091A
Publication Date:
October 11, 2021
Filing Date:
March 30, 2020
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
B32B5/20; C09J7/38; B32B7/027; B32B27/00; B32B27/18; B32B27/20; C09J7/10; C09J7/20; C09J11/04; C09J11/06; C09J201/00
Attorney, Agent or Firm:
Otani patent office



 
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