To provide an adhesive sheet preventing a chip from being dispersed by holding the chip with a sufficient adhesive force at dicing of a wafer, and preventing the chipping by reducing the vibration of the wafer (chip); and to provide an adhesive sheet enabling the pickup to be precisely carried out after reducing the adhesive force by the irradiation with energy rays to minimize the damage to the chip caused by the pickup even when the adhesive sheet is directly stuck or stuck through a resin film such as an adhesive to the back surface of the wafer as the adhesive sheet for the dicing.

The adhesive sheet has the following adhesive layer on a base material film: the adhesive layer is formed out of an adhesive consisting essentially of (B) an energy ray-polymerizable polymer obtained by introducing (C) ≥35 mmol compound having energy ray-polymerizable group to the side chain of (A) 100 g acrylic copolymer having 20-80mass% constituent unit derived from a vinyl acetate monomer, and having ≥50,000 sec holding power measured based on JIS Z-0237.

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