To provide an adhesive sheet in which scattering of a chip is prevented by holding the chip by sufficient adhesive force when wafer is made to dice and chipping can be prevented by suppressing vibration of the wafer (chip) and to provide an adhesive sheet in which pickup after reducing adhesive force by irradiation of energy beam can surely be carried out and damage to the chip by pickup can be minimized even when directly attached to the rear surface (grinding surface) of a wafer as the adhesive sheet for dicing or even when attached through a resin film such as an adhesive to the rear surface of the wafer.
The adhesive sheet has an adhesive layer formed by using an adhesive composition containing an adhesive acrylic copolymer polymer [component (A)], a vinyl acetate copolymer [component (B)] containing 50-99.99 mass% unit derived from a vinyl acetate monomer and an energy beam-curable monomer or oligomer [component (C)] as main components on a substrate film.
COPYRIGHT: (C)2006,JPO&NCIPI
| JPH08207211 | SURFACE TREATING MATERIAL OF POLYETHYLENE |
| JP6210827 | The sheet for semiconductor processing |
| JP3491806 | STUD |
Hiroshi Koike
Yoshiyanagi Shuji
| JP2002121511A |