Title:
粘着シート
Document Type and Number:
Japanese Patent JP6740489
Kind Code:
B2
Abstract:
This adhesive sheet (10) is used when sealing a semiconductor element on an adhesive sheet and is provided with a substrate (11) and an adhesive agent layer (12) that contains an antistatic agent. The surface resistivity of the adhesive agent layer (12) is less than 1011 Ω/□ after the adhesive sheet (10) is heated at 190°C for 60 minutes under a nitrogen atmosphere and then set aside for 24 hours at 23°C and 50% RH.
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Inventors:
Yoshinobu Takero
Application Number:
JP2019562008A
Publication Date:
August 12, 2020
Filing Date:
May 31, 2019
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/38; B32B27/00; C09J7/20; C09J7/29; C09J11/04; C09J11/06; C09J11/08; C09J133/04; H01L21/56
Domestic Patent References:
| JP2011129649A | ||||
| JP2017011057A | ||||
| JP2014189787A |
Foreign References:
| WO2017038919A1 |
Attorney, Agent or Firm:
Intellectual Property Office