Title:
ADHESIVE STRENGTH MEASURING APPARATUS AND ADHESIVE STRENGTH MEASURING METHOD
Document Type and Number:
Japanese Patent JP2013096852
Kind Code:
A
Abstract:
To provide an adhesive strength measuring apparatus in which measurement precision can be improved, and an adhesive strength measuring method.
An adhesive strength measuring apparatus 1 which measures an adhesive strength of an adhesion member W adhered to an adhered surface T1 of an adhered body T comprises pressing means which presses a corner portion W1 of the adhesion member W in a direction parallel to the adhered surface T1 and toward a proximal end side of the corner portion W1, load measuring means which measures a load caused by pressing, and adhesive strength output means which outputs a maximum load measured by the load measuring means.
Inventors:
SAEKI NAOYA
SHIZUHATA HIRONORI
SHIZUHATA HIRONORI
Application Number:
JP2011240185A
Publication Date:
May 20, 2013
Filing Date:
November 01, 2011
Export Citation:
Assignee:
LINTEC CORP
International Classes:
G01N3/00; G01N19/04
Domestic Patent References:
JPH08304269A | 1996-11-22 | |||
JPS6126156U | 1986-02-17 |
Attorney, Agent or Firm:
Intellectual Property Office