Title:
接着構造体及びその製造方法
Document Type and Number:
Japanese Patent JP7116922
Kind Code:
B2
Abstract:
To provide an adhesive structure formed by adhering a base material of which at least the surface is formed of a polyamide resin and an adherend to each other with excellent adhesive strength and a proper adhesion state.SOLUTION: An adhesive structure includes: a base material of which at least the surface is formed of a polyamide resin; a layer formed of a polymer having a phenolic hydroxy group and arranged on the surface of the base material; an epoxy resin-based adhesive layer arranged on the surface of the layer formed of the polymer; and an adherend member arranged on the surface of the adhesive layer.SELECTED DRAWING: None
Inventors:
Yuka Yamada
Takayuki Hirai
Takeuchi Hisato
Takayuki Hirai
Takeuchi Hisato
Application Number:
JP2019029539A
Publication Date:
August 12, 2022
Filing Date:
February 21, 2019
Export Citation:
Assignee:
Toyota Central R & D Labs.
International Classes:
B32B27/34; B32B7/12; B32B27/38; B32B27/42; C08J7/043; C09D5/00; C09D161/04; C09J163/00
Domestic Patent References:
| JP48032926A | ||||
| JP2000238218A | ||||
| JP2006182918A | ||||
| JP2013203023A | ||||
| JP2017082144A | ||||
| JP2018161768A | ||||
| JP2018021203A |
Attorney, Agent or Firm:
Patent Attorney Corporation St. Crest International Patent Office