Title:
粘着テープ貼付け方法および粘着テープ貼付け装置
Document Type and Number:
Japanese Patent JP7130401
Kind Code:
B2
Abstract:
The present invention provides a method and an apparatus for joining adhesive tape which can reliably resolve differences of tension of areas created when adhesive tape is cut into a prescribed shape in accordance with a work when attaching the adhesive tape to the work. A second tension mechanism (37) includes a first and a second tension mechanism (53, 55) arranged in parallel in a feeding direction (L). The first and the second tension mechanism (53, 55) are controlled to move independently in a width direction to tension adhesive tape (DT). The first tension mechanism (53) grips an area (L1) relatively close to a resection area (C) and gives relatively large tension (P1) to the area (L1) in the width direction. The second tension mechanism (55) grips an area (L2) relatively far from the resection area (C) and gives relatively small tension (P2) to the area (L2) in the width direction.
Inventors:
Kanajima Aji
Application Number:
JP2018064696A
Publication Date:
September 05, 2022
Filing Date:
March 29, 2018
Export Citation:
Assignee:
NITTO DENKO CORPORATION
Nitto Seiki Co., Ltd.
Nitto Seiki Co., Ltd.
International Classes:
H01L21/683; H01L21/301
Domestic Patent References:
| JP11297643A | ||||
| JP2014049627A | ||||
| JP2014086532A | ||||
| JP6066032U |
Attorney, Agent or Firm:
Tsutomu Sugitani
Hiroyuki Todaka
Tomohiko Sugiya
Kurihara Kaname
Nobuyoshi Aono
Hiroyuki Todaka
Tomohiko Sugiya
Kurihara Kaname
Nobuyoshi Aono
Previous Patent: Adaptive covers for cooling passages by additive manufacturing
Next Patent: BATTERY CAPACITY METER
Next Patent: BATTERY CAPACITY METER