Title:
粘着テープカッター装置
Document Type and Number:
Japanese Patent JP6899122
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive tape cutter device in which the adhesion surfaces of a wide decorative adhesive tape and a narrow transparent or plain adhesive tape are adhered to remove a function from a lower half or more paste surface of the adhesive tape in a width to allow a part of the paste surface to remain on the rear surface of the adhesive tape and which can be used for tags and the like.SOLUTION: In an adhesive tape cutter device, opening and closing interlock plates 3-1, 3-2 having pressing rollers at tip parts and convex parts at rear end parts are rotatably incorporated into two cylinders 10; a wide tape coated on a rear surface with a paste and a narrow tape coated on a rear surface with a paste are pulled out and guided to a groove, and then a cap 2 of a housing 1 is closed; when closing the cap of the housing, the convex parts 3-3, 3-4 at the rear end parts of the opening and closing interlock plates are pushed into the housing, whereby two opening and closing interlock plates rotate, and the pressing rollers at the tip parts press the wide tape coated on a rear surface with a paste and the narrow tape coated on a rear surface with a paste to adhere the paste surfaces.SELECTED DRAWING: Figure 3
Inventors:
Yukio Taniguchi
Tetsuo Kurose
Tetsuo Kurose
Application Number:
JP2017011013A
Publication Date:
July 07, 2021
Filing Date:
January 25, 2017
Export Citation:
Assignee:
Duck Well Processed Paper Co., Ltd.
International Classes:
B65H35/07
Domestic Patent References:
| JP49016712Y1 | ||||
| JP51099756U | ||||
| JP2013000956A | ||||
| JP2010234775A | ||||
| JP9066919A | ||||
| JP55035020U | ||||
| JP2002179295A | ||||
| JP61151952U |
Attorney, Agent or Firm:
Mori patent office
Toshio Mori
Osamu Nakano
Izumi etc.
Toshio Mori
Osamu Nakano
Izumi etc.