Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE TAPE FOR PLATE-LIKE BUILDING MATERIAL, PLATE-LIKE BUILDING MATERIAL-APPLIED STRUCTURE AND METHOD FOR APPLYING PLATE-LIKE BUILDING MATERIAL
Document Type and Number:
Japanese Patent JP2005213339
Kind Code:
A
Abstract:

To provide an adhesive tape which is used for plate-like building materials and prevents the deterioration in the design, rain water impermeability and the like of a wall surface, even when the dimension of the plate-like building material is changed, to provide a plate-like building material-applied structure, and to provide a method for applying the plate-like building material.

The method for applying the plate-like building material comprises flatly fixing a plurality of metal-sandwiched panels 20 to a ground material 41, filling a space 20a between the metal-sandwiched panels 20 with a filler 30 not thinned when cured, adhering an adhesive tape 1 for the plate-like building material to the upper side of the filled space 20a, and then coating the product with a finishing coating 50. The adhesive tape 1 for the plate-like building material, comprising a flexible substrate 11, a surface layer 12 disposed on the front surface side of the substrate 11, and an adhesive layer 13 disposed on the back surface side of the substrate 11, is characterized in that the elasticity of the adhesive layer 13 is larger than that of the surface layer 12.


Inventors:
NAKAMURA MOTOHIRO
NAKAMURA TAKAHIKO
IWAI KATSUMI
NAKAGAWA TAKESHI
SHIGESHIRO KENJI
Application Number:
JP2004020735A
Publication Date:
August 11, 2005
Filing Date:
January 29, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
INAX CORP
International Classes:
E04F13/07; C09J7/02; C09J201/00; E04F13/00; E04F13/08; (IPC1-7): C09J7/02; C09J201/00; E04F13/00; E04F13/08
Attorney, Agent or Firm:
Kei Nakamura