To provide an adhesive tape for processing a semiconductor substrate which allows a stable processing and does not require changes in the manufacturing conditions in each step by minimizing a change in the adhesiveness of the tape by the storage condition and the time, does not cause soiling of the back side of a chip and reduces chipping of the chip in dicing and improves the yield for a semiconductor substrate manufacturing process.
The manufacturing process of the adhesive tape for processing a semiconductor substrate comprises coating an adhesive agent containing a base resin, a radiation-polymerizable resin, a radiation polymerization initiator and a crosslinking agent on the surface of a film substrate which has a functional group reactive with the adhesive agent and are transparent to ultraviolet and/or electron beam and heat-treating the coated film for 1-14 days at 40-70°C.
MARUMO TAKESHI
ODA NAOYA
TAZAWA HIROSHI
| JP2003231875A | 2003-08-19 | |||
| JP2003277699A | 2003-10-02 | |||
| JP2000044893A | 2000-02-15 |