Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE AND ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP2011144260
Kind Code:
A
Abstract:

To provide an adhesive containing a polyimide resin composition and having light color, flexibility and heat-resistance and to provide an adhesive tape produced by using the adhesive.

There are provided: the adhesive produced by ultraviolet ray irradiation of the polyimide resin composition containing a polyimide comprising ≥50 mol% of a polyoxyalkylene diamine as a diamine component based on the total amount of diamine or an organic solvent solution of the polyimide and ≥0.05 mol and ≤10 mol of a maleimide compound based on 1 mol of the polyimide; and the adhesive tape produced by using the adhesive.


More Like This:
JPH0827430FILM ADHESIVE IMPROVED IN PHYSICAL PROPERTY AT HIGH TEMPERATURE AND ITS PRODUCTION
JP2008277802ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME THEREWITH AND SEMICONDUCTOR DEVICE USING THEME
JP7414301Polyimide film for semiconductor packages
Inventors:
MIFUJI TAKESHI
OISHI JITSUO
KIHARA HIDETA
Application Number:
JP2010006203A
Publication Date:
July 28, 2011
Filing Date:
January 14, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C09J179/08; C08G73/10; C09J7/02; C09J11/06
Domestic Patent References:
JP2003234558A2003-08-22
Foreign References:
WO2008041723A12008-04-10
Attorney, Agent or Firm:
Takashi Nagai



 
Previous Patent: APPARATUS FOR REMOVING PHOSPHORIC ESTER IN WASTE OIL AND TREATMENT SYSTEM OF WASTE OIL CONTAINING PC...

Next Patent: INK COMPOSITION