Title:
粘着テープ
Document Type and Number:
Japanese Patent JP5689269
Kind Code:
B2
Abstract:
A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a heat-resistant layer; a base layer; and a pressure-sensitive adhesive layer in this order, wherein: the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young's modulus at 25° C. of 150 MPa or less; and the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110° C. to 200° C. and a molecular weight distribution “Mw/Mn” of 3 or less.
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Inventors:
生島 伸祐
土生 剛志
浅井 文輝
大山 高輝
鳥居 忠雄
亀井 勝利
加藤 有樹
高橋 智一
土生 剛志
浅井 文輝
大山 高輝
鳥居 忠雄
亀井 勝利
加藤 有樹
高橋 智一
Application Number:
JP2010207826A
Publication Date:
March 25, 2015
Filing Date:
September 16, 2010
Export Citation:
Assignee:
日東電工株式会社
International Classes:
B32B27/00; B32B27/32; C09J7/29; H01L21/301; H01L21/304
Attorney, Agent or Firm:
Takafumi Momii