Title:
ADHESIVE FOR THERMOPLASTIC RESIN
Document Type and Number:
Japanese Patent JP2017031317
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive for a thermoplastic resin capable attaining the improvement of appearance by suppressing the deformation of a thermoplastic resin molding while retaining required adhesive force owing to the suppression of a solvent to the thermoplastic resin molding.SOLUTION: Provided is an adhesive for a thermoplastic resin adhering a thermoplastic resin molding and the object to be adhered, comprising: a binder resin (A); a solvent (B) capable of dissolving the thermoplastic resin molding; and a surfactant (C) being either or both of a cationic surfactant and an amphoteric surfactant.SELECTED DRAWING: None
Inventors:
SAWADA HIROSHI
MIZUTANI MANABU
MIZUTANI MANABU
Application Number:
JP2015152426A
Publication Date:
February 09, 2017
Filing Date:
July 31, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C09J201/00; C09J11/06; C09J127/06
Domestic Patent References:
| JP2000109777A | 2000-04-18 | |||
| JPS5016827B1 | 1975-06-16 | |||
| JPH10298519A | 1998-11-10 |
Attorney, Agent or Firm:
Toshio Nishizawa