Title:
ADHESIVE FOR THERMOPLASTIC RESIN
Document Type and Number:
Japanese Patent JP2018012757
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive for thermoplastic resin which can suppress softening and swelling of a portion other than an adhesive portion in an adhesive material made from a thermoplastic resin even when extruded from the adhesive portion at the time of application.SOLUTION: An adhesive for thermoplastic resin can contain at least a first solvent which can dissolve at least an adhesive material made from a thermoplastic resin and has volatility, a thermoplastic resin dissolvable in the first solvent, and a second solvent being hydrocarbon which is liquid at normal temperature.SELECTED DRAWING: None
Inventors:
SAWADA HIROSHI
SAKAMOTO KENJI
JEON TIN
SAKAMOTO KENJI
JEON TIN
Application Number:
JP2016142188A
Publication Date:
January 25, 2018
Filing Date:
July 20, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C09J127/06; C09J11/06
Domestic Patent References:
| JPS5388042A | 1978-08-03 | |||
| JPH0893147A | 1996-04-09 | |||
| JP2007106957A | 2007-04-26 | |||
| JPS4722439A | ||||
| JPS5738834A | 1982-03-03 | |||
| JP2016117813A | 2016-06-30 |
Foreign References:
| CN105199638A | 2015-12-30 |
Attorney, Agent or Firm:
Toshio Nishizawa