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Title:
ADHESIVE FOR USE IN HEAT-SENSITIVE STENCIL PRINTING MASTER PAPER
Document Type and Number:
Japanese Patent JPH0431476
Kind Code:
A
Abstract:

PURPOSE: To improve curing properties, solvent resistance, printing resistance and punchability by compounding urethane diacrylate, epoxy diacrylate, polyol diacrylate, a photoreaction initiator and a tertiary amine.

CONSTITUTION: 100 pts.wt. urethane diacrylate obtained by reacting urethane diisocyanate and hydroxylated acrylate, 10-200 pts.wt. epoxy diacrylate obtained by reacting an epoxy compound (e.g. bisphenol A diglycidyl ether) and acrylic acid, 5-50 pts.wt. polyol diacrylate (e.g. ethylene glycol diacrylate) are compounded to give a mixture. To 100 pts.wt. said mixture are added 1-10 pts.wt. photoreaction initiator (e.g. 2-methyl-1-(4-alkylthiophenyl)-2- morpholinopropen-1-one) and 1-10 pts.wt. tertiary amine (e.g. triethanolamine) to give a adhesive having a viscosity of 100-100,000cp at 20°C for use in heat- sensitive stencil printing master paper.


Inventors:
OKADA YUKIO
SATO NOBUYUKI
Application Number:
JP13414190A
Publication Date:
February 03, 1992
Filing Date:
May 25, 1990
Export Citation:
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Assignee:
TOKYO PRINTING INK MFG CO LTD
International Classes:
C08F299/00; C08F290/00; C09J4/02; C09J161/06; (IPC1-7): C08F299/00; C09J4/02