PURPOSE: To obtain a conductive adhesive suitable for bonding electronic components to a circuit board by adding a conductive filler which is composed of a core and a shell and in which the hardness of the core is higher than that of the shell, and the resistivity of the shell is lower than that of the core to an adhesive.
CONSTITUTION: An adhesive prepared by adding a filler to an adhesive. The filler is the one which is composed of a core and a shell surrounding the core and in which the hardness of the core is higher than that of the shell, while the resistivity of the core is lower than that of the core. Because the resistivity of the conductive filler is low, this adhesive can give a bond having a resistance lower than the conventional one between, for example, a bump and a pad. Further, because the conductive filler has sufficient hardness, the bond does not collapse even when a stress is exerted thereon, and the electrical resistance between, for example, a bump and a pad can be long kept at the initial value. Therefore, it is possible to bond electronic components with a reliability better than the conventional.
DATE HITOAKI
USUI MAKOTO
NATORI KATSUHIDE
