ADHESIVE AND COMPOSITE CONJUGATE

Japanese Patent JP2017171833

A

PROBLEM TO BE SOLVED: To provide an adhesive having low dielectric constant and low dielectric loss tangent and capable of adhering a metal layer and a heat resistant resin layer rigidly and a composite conjugate by rigidly adhering the metal layer and the heat resistant resin layer by the additive.SOLUTION: There is provided an adhesive used for adhering a metal layer and a heat resistant layer and mainly containing a modified block copolymer hydride (E) by introducing an alkoxysilyl group into a bock copolymer hydride (D) by hydrogenating 90% or more of carbon-carbon unsaturated bonds of a main chain and a side chain and carbon-carbon unsaturated bonds of an aromatic ring of a bock copolymer (C) consisting of at least two polymer blocks (A) mainly containing a constitutional unit derived from an aromatic vinyl compound and at least a polymer bock (B) mainly containing a constitutional unit derived from a chain conjugated diene compound, and having a ratio of wA and wB, wA:wB, where wA is weight fraction of all polymer block (A) in the whole block copolymer (C) and wB is weight fraction of all polymer block (B) in the whole block copolymer (C) of 30:70 to 60:40. There is also provided a composite conjugate by adhering the heat resistant resin layer and a metal layer by the adhesive.SELECTED DRAWING: None

CHIBA OMICHI
OBARA TEIJI

JP2016062066A

September 28, 2017

March 25, 2016

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NIPPON ZEON CO

C09J153/02; B32B15/08; B32B27/00; C09J11/06; H05K1/03

JP2015078090A	2015-04-23
JP2005320459A	2005-11-17
JP2008189823A	2008-08-21

WO2014077267A1	2014-05-22
WO2013176258A1	2013-11-28
WO2012043708A1	2012-04-05
WO2014147903A1	2014-09-25
WO2012014757A1	2012-02-02

Haruhito Oishi

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