Title:
Adhesives, a glue film, a semiconductor device, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6241415
Kind Code:
B2
Abstract:
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a)a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.
Inventors:
Koichi Fujimaru
Toshio Nonaka
Toshio Nonaka
Application Number:
JP2014506632A
Publication Date:
December 06, 2017
Filing Date:
December 04, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J179/08; C09J7/00; C09J11/04; C09J163/00; C09J183/04; C09J193/04; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2008094870A | ||||
| JP2000144082A | ||||
| JP2006144022A | ||||
| JP2004319823A | ||||
| JP2004211064A |
Foreign References:
| WO2006132165A1 |