Title:
Adhesives melting equipment which has a quick exchange pump integrated assembly object, and a related method
Document Type and Number:
Japanese Patent JP6224439
Kind Code:
B2
Abstract:
An adhesive melter (10) includes a melter support frame (16) with a spring-loaded support and a manifold (12) for receiving molten adhesive. The melter also includes a pump pack assembly (18) having a rigid frame (20) carrying a pump (14) for directing flow of molten adhesive through the manifold, a motor (22), and a drive coupling (24) operatively connecting the pump and motor. The pump pack assembly is collectively mounted as a unit on the melter support frame by positioning the rigid frame on the spring-loaded support, moving the pump into abutment with the manifold, and fastening the pump into fluid-tight engagement with the manifold, the support adjusting in position during fastening to assist with carrying the pump pack assembly as a cantilever load.
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Inventors:
Charles P. Gunzer
Application Number:
JP2013244660A
Publication Date:
November 01, 2017
Filing Date:
November 27, 2013
Export Citation:
Assignee:
NORDSON CORPORATION
International Classes:
B05C5/04; B01J4/00; B05C11/10; F04B15/04; F04B53/00; F16B1/00
Domestic Patent References:
| JP2004116782A | ||||
| JP5833826Y2 | ||||
| JP2002282761A | ||||
| JP5357241A | ||||
| JP200477133A | ||||
| JP2010518233A | ||||
| JP2005238233A | ||||
| JP2015510566A | ||||
| JP9192577A | ||||
| JP2004268017A |
Attorney, Agent or Firm:
Okabe
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kosuke Uchida
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kosuke Uchida