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Title:
ADJUSTING METHOD OF HEAT DISSIPATION CONSTANT
Document Type and Number:
Japanese Patent JP3245687
Kind Code:
B2
Abstract:

PURPOSE: To adjust heat dissipation constant of temperature-sensitive element by building the temperature-sensitive element into a bridge circuit of a sensor and then energizing the circuit.
CONSTITUTION: A temperature-sensitive element 4 is suspended in a container TO-5 by means of lead wires 5, 5 connected with hermetic terminals 6, 6. Since heat dissipation constant of the temperature-sensitive element 4 varies depending on the distance between the suspended temperature-sensitive element 4 and the container, it can be adjusted arbitrarily by partially deforming the container mechanically thereby varying the distance between the temperature-sensitive element 4 and the container. When two samples having different heat dissipation constants are built in a bridge circuit and output voltage from the bridge circuit is regulated to zero by deforming the container for a sample having lower terminal voltage partially inward, heat dissipation constants for both samples can be matched.


Inventors:
Tsutomu Sato
Shuji Sakurai
Application Number:
JP14858292A
Publication Date:
January 15, 2002
Filing Date:
May 15, 1992
Export Citation:
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Assignee:
Oizumi Manufacturing Co., Ltd.
International Classes:
H01C7/04; (IPC1-7): H01C7/04
Domestic Patent References:
JP63123083U
Attorney, Agent or Firm:
Naka Kanno