Title:
ADJUSTMENT METHOD OF POLISHING PAD
Document Type and Number:
Japanese Patent JP2016179513
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adjustment method of a polishing pad for adjusting the polishing pad so that a workpiece can be polished in a uniform thickness.SOLUTION: An adjustment method of a polishing pad (44) comprises an initialization step of processing an action surface (44a) of the polishing pad in a predetermined shape, a polishing step of polishing a workpiece by making the action surface of the polishing pad act on an action object surface (11b) of the workpiece (11), a measurement step of measuring irregularity of the workpiece polished in the polishing step along the radial direction and an adjustment step of adjusting a shape of the action surface of the polishing pad so that the workpiece can be polished in a uniform thickness, and in the adjustment step, the action surface is adjusted in a shape of projecting an area (A3) of the action surface corresponding to a convex area (A1) of the workpiece from an area (A4) of the action surface corresponding to a concave area (A2) of the workpiece.SELECTED DRAWING: Figure 7
Inventors:
WATANABE SHINYA
ASAI KOHEI
ASAI KOHEI
Application Number:
JP2015059944A
Publication Date:
October 13, 2016
Filing Date:
March 23, 2015
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B37/00; B24B53/00; B24B53/12; H01L21/304
Domestic Patent References:
| JP2004047876A | 2004-02-12 | |||
| JPH11170155A | 1999-06-29 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Tomohiro Okamoto